PCB Equipment uye Maitiro

1. Engineering Document Production

Munzvimbo yekugadzira PCB, CAM (Computer-Aided Manufacturing) inobuda seyakakosha tekinoroji, kuronga shanduko yemadhizaini ebhodhi redunhu kuita data rinokosha uye mafaera ehurongwa anodiwa pakugadzira zvinobatika. Pakati payo, CAM inoshanda senzira yekuchinjisa dhizaini yedhizaini yedhizaini mune yekugadzira data, yakarongedzwa kuti ibatanidzwe mukati mekufungidzira maitiro uye kudhirowa mapuroteni.
Mukati mePCB yekugadzira spectrum, CAM inoita basa rakasiyana-siyana, rinosanganisira: Gerber data conversion, Process analysis,Process optimization,Process optimization,Process setup,Navigation files output,Process verification,Data management;Muchidimbu,CAM software inoshanda sebhiriji rinobatanidza dhizaini kune kugadzira. , inogonesa shanduko yedata yakatsetseka kuita chaiyo PCB zvigadzirwa.

2. Kucheka Zvinhu

Kutanga kwekugadzirwa kwePCB kunotanga nekushandiswa kwepepa rakakura rezvinhu. Tichiziva zvipingaidzo zvinounzwa nePCB yekugadzira michina yekugadzira uye kugona kugadzira, nzvimbo yekugadzira inotara yakatarwa maparamendi anosanganisira ese epasi uye epamusoro zvikumbaridzo zvine chekuita nekugadzirisa zviyero. Kuve nechokwadi chekutevedzera kune izvi chaizvo zvakatemwa, matanho ekutanga anosanganisira kunyatsoteera kune yekugadzira mirairo (MI). Izvi zvinoraira kushandiswa kwekutanga kwemuchina wekucheka wega kuti unyatso kupatsanura zvinhu zvakasvibirira, zvinonzi seCopper Clad Laminate (CCL), kuita zviyero zvinopindirana zvisina musono nehukuru hwakatarwa hwekugadzirisa. Ichi chikamu chekugadzirira chakakosha kune zvinotevera zvikamu zvekugadzira, zvichisimbisa iyo chaiyo uye methodical maitiro akabatanidzwa mukugadzira PCB.

3. Dhinda zvidimbu zvemukati

Iyo yedunhu pateni inoendeswa kubhodhi pamusoro uchishandisa photomask uye UV kuratidzwa kweiyo photosensitive yakaoma firimu laminate. Chiedza cheUV chinokonzera polymerization munzvimbo dzakafumurwa dzefirimu rakaoma. Iyo photolithography process inoitwa munzvimbo yakachena yekamuri.
Imaging inzira yekushandura dhizaini yemagetsi data kuita fomati inoverengwa neanoptical plotter. A photoplotter anobva ashandisa ultraviolet mwenje kuburitsa mufananidzo wakashata wedunhu pateni zvakananga papaneru kana photomask firimu.

4. Inner layer etching

Inner layer etching, iyi idanho rakakosha. Chinangwa apa ndechekubvisa mhangura yakawandisa kubva papanera kuburikidza neyakarongwa zvakanaka etch process. Mushure mekupedza iyi nhanho yakakosha, iyo yakasara yakaoma firimu inonyatso kubviswa, ichisiya yakanyatso gadziridzwa yemhangura yedunhu inonyatso ratidza kuoma kweiyo yakatsanangurwa dhizaini.

5. Inner Layer AOI

Iyo Inner Layer Automatic Optical Inspection (AOI) paHighleap inzvimbo yakakosha yekudzora mhando. Iyi yakaoma nzira inofananidzira kutenderera kunopesana nemifananidzo yedhijitari kuve nechokwadi chekugadzirisa dhizaini uye kubvisa kusakwana. Iyo yakazara board scan uye kuongororwa nenyanzvi dzakanyatsodzidziswa inoona chero kukanganisa. Zvikuru, Highleap inotsigira yakaomesesa mwero - akavhurika maseketi haana kugadzirwa. Kuzvipira uku kunoratidza kuzvipira kwedu kumhando isingachinjiki.

6. Oxidation

Iyo PCB brown oxide process, inozivikanwawo sePCB brownization kana dema oxide process, inoshanda chinangwa chekusimudzira kunamatira uye solderability yenzvimbo dzemhangura pabhodhi redunhu. Kuita uku kunosanganisira kudzorwa kwekemikari oxidation yemhangura iri pachena, ichiita dhadha rebrown kana dema oxide pamusoro pemhangura. Iyi oxide layer inovandudza kubatana pakati pemhangura uye substrate zvinhu, pamwe nekusimudzira kunyorova kuri nani panguva yekushambadzira. Pamusoro pezvo, iyo brown oxide layer inoshanda sechidziviriro chinodzivirira, ichichengetedza matara emhangura kubva mukusvibiswa uye kuve nechokwadi chenguva refu yesherufu uye kushanda kwakavimbika kwePCB.

7. Lay-up uye Bond (Lamination)

Inner layers inoiswa oxidized yobva yaturikidzwa uye yakarongeka kuti iite chimiro chebhodhi. Prepreg zvinhu zvinopatsanura zvidimbu se insulator, nepo mapepa emhangura anowedzerwa kumusoro uye pasi. Iyo lamination process inonyatso kusanganisa kupisa, kudzvanywa, uye photoresist kuumba yakabatana laminate. Matanho anopisa kusvika ku375 ° F uye anomanikidzwa kubva pa275-400 psi. Mushure mekuporesa pakupisa kwepamusoro, kudzvinyirira kunosunungurwa zvishoma nezvishoma uye bhodhi rinotonhodzwa muhurongwa hunodzorwa. Iyi yekunyatsoita maitiro inogadzira inonzwika, yepamusoro-mhando PCB.

8. Kuchera PCB

Iyo PCB yekuchera maitiro yakakosha pakugadzira hukama pakati pematanho. Makomba anozivikanwa se vias anobvumira maronda uye zvikamu kuti zvibatanidze pamabhodhi akawanda, zvichiita kuti matunhu akaomarara ashande. Pamusoro pezvo, maburi anochererwa kuburikidza-gomba zvikamu uye mapoinzi ekukwira. Precision drilling yakakosha kuti uve nechokwadi chekurongeka uye kubatana muPCB dhizaini.

KuHighleap, tinoshandisa zvibooreso zvinodzorwa nenhamba uye software yepamberi kugadzira mabhodhi ane maburi akavimbika. Maburi ese ari maviri akatenderera uye rectangular slots anodhiriwa kuti aenderane nemagadzirirwo acho chaizvo. Izvi zvinovimbisa dhizaini yekuvimbika ingave yevias, zvikamu, kana kuchinjika mukuiswa. Uyezve, isu tinopa metalized slot milling kugona. Iyi michina yekugadzira migero mumhangura yePCB uyezve electroplates madziro eiyo slot kugadzira nzira dzinofambisa. Metalized slots inoshanda akasiyana mabasa akadai seRF transmission mitsara kana yakakwira ikozvino kugona kubatanidza. Iine hunyanzvi mukudhirowa nekugaya simbi, Highleap inoburitsa maPCB ane emhando yepamusoro gomba uye mashandiro epamberi.

9. Electroless mhangura deposition

Electroless copper deposition inoumba chitubu chemhangura chakapfava pamadziro emukati emakomba akacherwa, kumisa kuenderera kwemagetsi pakati pematanho. Iyi chaiyo kemikari maitiro inoda kungwarira kutonga kuti ive nechokwadi chedhipoziti yakavimbika kunyangwe pane zvisiri zvesimbi. Iyo inotevera kuburikidza-paburi yekuisa inoputira madziro egomba uye bhodhi pamusoro neiyi copper yakatetepa.

PaHighleap, isu tinonyatso kuenzanisa ukobvu hwemhangura yemhangura pakati pe5-8 microns panguva yekuputira mapaneru. Izvi zvinotevera yekutanga PTH layer uye inokwidziridza mhangura yekuzotevera etching zvinoenderana neayo track uye gap yakatarwa. Yedu yeunyanzvi yeplating orchestration inozadzisa zvinonyanya kudiwa PCB.

10. Firimu rekunze rakaoma (Mufananidzo wekunze)

Outer layer yakaoma firimu lamination inoshandisa photosensitive coating pane ekunze copper layers yePCB isati yafungidzira nekunamira. Iyo yakaoma firimu photoresist inodzivirira mhangura panguva yekucheka kuti iite ma conductors uye mitsetse. Kutanga, kupisa uye kudzvinyirira kunonamatira firimu yakaoma. Tevere, kuratidzwa kweUV kuburikidza nefotomask uye kugadzira gadzira maitiro ekupikisa. Iyo yakasara photoresist inodzivirira mitsara yemhangura kubva pakucheka. Pakupedzisira, iyo firimu yakaoma inobviswa, ichisiya chete yaidiwa conductor pattern.

KuHighleap, isu tinoshandisa yakakwira lamination uye exposure maitiro akakosha kuti uwane mitsetse yakanaka yekugadzirisa uye kushivirira kwakasimba. Unyanzvi hwedu mune yekunze yakaomeswa firimu patterning inoburitsa maPCB ane akanakisa emhando conductor.

11. Graphic Plating

Electroplating muPCB yekugadzira yakakosha pakusimudzira kutenderera kutenderera uye conductivity. Maitiro acho anoshandisa inodzorwa electrochemical deposition kuti inyatso kupfekedza nzvimbo dzakatarwa dzebhodhi neyakakura yemhangura layer. Electroplating haingo simbisa trace uye pad conductivity asi zvakare inogonesa kugadzirwa kwezvinhu zvakanaka maererano nedhizaini yakatarwa.

PaHighleap, isu tinoita electroplating nekungwarira uye nemazvo. Izvi zvinowedzera kusimba uye kushanda kwemagetsi kwePCB yapera. Unyanzvi hwedu mu electrochemical deposition inogadzira mabhodhi edunhu ane akasimba, akavimbika wedunhu akagadzirirwa kushanda.

12. Etch yekunze layer

Ekunze layer etching muPCB kugadzira kwakakosha pakunatsa dhizaini patani pabhodhi. Iyo inodzorwa kemikari process inobvisa yakawandisa mhangura kubva munzvimbo dzisina kusarudzwa, ichisiya yakanyatso kutsanangurwa mitezo, mapadhi, uye yakabatana. Etching inogadzira iyo yakarongwa dhizaini nekuenzanisa dhizaini dhizaini nemazvo. Iyo zvakare inogonesa yakaoma maficha uye optimized track zviyero.

Iko kurongeka kwakanyatso kurongeka kweyekunze layer etching kunobatsira zvakanyanya mukurongeka, kuvimbika, uye kushanda kwechigadzirwa chePCB chekupedzisira. Izvi zvinosimbisa kukosha kwe etching mukugadzirwa kwemagetsi masisitimu. Yakakodzera etching tekinoroji yakakosha kune mabhodhi anosangana nemaitiro ekugadzira.

13. Outer layer AOI

Outer layer Automated Optical Inspection (AOI) inosimbisa kunaka kwePCB conductor mapatani mushure mekucheka. PaHighleap, AOI yepamberi inoenzanisa mitsara yemifananidzo kune yekutanga dhizaini kuona kutsauka. Izvi zvinowana zvikanganiso sekuvhura, zvikabudura, kutyorwa kwenzvimbo, uye kukanganiswa kwepadhi kutanga.

Highleap inoshandisa data yeAOI kuti ione nekukasika uye kugadzirisa nyaya dzemaitiro kuburikidza nekuongorora chikonzero. Isu tinodzivirira mabhodhi asina kukwana kuti aenderere mberi nekugadzirisa. Iyi yemhinduro loop inobvumira kuenderera mberi kwekuvandudza kwemaitiro edu ekugadzira. Kuita kuomarara kwekunze kwekutarisa kwakakosha pakuona yakavimbika, yepamusoro-inoshanda maPCB.

14. Soldermask

Iyo solder mask application muPCB yekugadzira inoita basa rakakosha mukudzivirira nekusimudzira kuvimbika kwedunhu. Iyo yakaonda solder mask layer inopfeka nzvimbo dzisina kurongedzerwa. Izvi zvinodzivirira nzira dzemhangura uye zvikamu kubva kune zvisingatarisirwe solder mabhiriji, mwando, huruva uye zvimwe zvakatipoteredza. Pamusoro pezvo, solder mask inokwenenzvera kusangana nekuvhara solder kunzvimbo dzakatarwa.

Nekushandisa zvine hungwaru kwe solder mask, maitiro anovandudza hupenyu hurefu, solderability, uye huwandu hwese hwekupedzisira PCB. Izvi zvinobvumira kubatanidzwa kusina musono mumagungano emagetsi. Yakakodzera solder mask yakakosha kune akasimba, akavimbika edunhu mabhodhi.

15. Iegend & Silkscreen

Iyo PCB yemhando yekudhinda maitiro inopa yakajeka yekuona chiziviso nekunyatso shandisa mavara, zviratidzo, uye alphanumeric mamaki. Aya macherechedzo anotendeseka uye asingagumi anopa ruzivo rwakakosha senge vagadziri vechikamu, nhamba dzereferensi, marogo, uye ruzivo rwekugadzira. Hunhu hwekudhinda hunobatsira kusangana, kugadzirisa, uye kugadzirisa nekufambisa inoshanda uye isina kukanganisa-isina PCB kubata. Izvi zvinowedzera kurongeka kwese, kuteedzera, uye hunyanzvi hwechigadzirwa chekupedzisira. Kubudirira kwebhodhi kudhinda uye kuisa mazita kunogonesa kutaurirana uye kushanda mukati memagetsi emagetsi masisitimu.

16. pamusoro Finish

Kupedzwa kwakasiyana-siyana kwepamusoro kunoiswa kumatunhu akafumurwa emhangura anotevera PCB kugadzirwa. Izvi zvinoshanda kuchengetedza pamusoro uye optimize solderability. Mapeji akajairika anosanganisira Electroless Nickel Immersion Gold (ENIG), Hot Air Solder Leveling (HASL), uye Immersion Silver. Kupera kwega kwega kunoiswa mukunyatso kudzora ukobvu uye kuedzwa kuti ive solderability kuti ive nechokwadi chemhando uye kuita. Iko kushandiswa kwehungwaru kwepasi kunopedza kuchengetedza PCB uye inogonesa yakavimbika solder kubatana.

17. Electronic test

Impedance kuyedzwa uye yemagetsi kuyedzwa kwakakosha pakuita PCB mashandiro uye mhando. Impedance kuyedza inosimbisa chiratidzo chetrace impedance, iyo yakakosha kune yakakwira-kumhanya maseketi. Kuyerwa kwezviyero zvinosimbisa kutevedzera dhizaini, inosimudzira kutendeseka kwechiratidzo.

Kuyedzwa kwemagetsi kunoongorora kutendeseka kwedunhu nekuona mavhura, mapfupi, uye kubatana kwakakodzera. Nzira dzakaita senge kubhururuka kuferefeta uye yekumisikidza kuyedza inoongorora bhodhi zvichienderana nedata rekutanga kuvimbisa kunaka uye kushanda. Pamwe chete, idzi nhanho dzekuyedza dzinotsigira kuvimbika, kuita, uye nemazvo ekupedzisira PCB chigadzirwa.

18. Nhoroondo

Iyo profil nhanho inosanganisa kuchekwa chaiko kwemapanera ekugadzira kuita saizi uye zvimiro zvakatarwa, zvichinyatsoenderana nedhizaini yemutengi sekutsanangurwa kwazvinoitwa mune data regerber. Iyi nzira inopa nhatu dzekutanga sarudzo dzekupa array kugovera kana mapaneru kugovera: scoring, routing, kana punching. Kunyatsoomerera kune zvakadhirowa zvinopihwa nevatengi, zviyero zvese zvinoongororwa zvine hungwaru kuti zvionekwe chokwadi uye kutevedza, kuve nechokwadi chekuti pani inowana fomu rinodiwa uye zviyero zvinoenderana nezvakatemwa.